Thermal Management & Electronics Cooling

Copes Engineering delivers advanced thermal simulation consulting to optimize heat-critical systems in all domains Leveraging deep expertise in leading simulation tools, we model conduction, convection, and radiation effects under both steady-state and transient conditions. Our analysis enables informed design decisions, prevents thermal failures, and reduces reliance on costly physical prototyping by predicting real-world behavior early in the development cycle.

From board-level cooling to complete system thermal architectures, we provide simulation-driven insights that enhance reliability, performance, and thermal efficiency.

Cooling of electronic components
  • • development of printed circuit board (PCB)
  • • development of electronic control units
Our Expertise Includes:
  • • Electronics Cooling & Thermal Management
  • • Power Systems Optimization
  • • Battery Thermal Management Solutions
  • • Aerospace Thermal Systems Engineering
  • • Industrial & Embedded Thermal Systems
  • • Multiphysics Heat Source Modeling & Simulation
  • • Heat Exchangers & Advanced Thermal Interfaces